ESD PC/ABS Compound

● The ESD compound is a formulation of PC/ABS resin and a certain amount of permanent antistatic agent or antistatic masterbatch.Glass fiber and flame retardent are optional.
● Surface resitivity 10^8-10^11 Ohms/sq,colourable
● Features and application
– High flow ,heat resistance
– Electronic components;Home appliances housing

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Description

esd abs,esd pcPC/ABS ESD Compound Properties

PERMANENCE
Specific Gravity 1.20 D792
Molding Shrinkage 0.40 – 0.60 % D955
MECHANICAL
Impact Strength, Izod notched 75 J/m D256
Tensile Strength 70 MPa D638
Tensile Elongation 8 % D638
Tensile Modulus 2700 MPa D638
Flexural Strength 90 MPa D790
Flexural Modulus 2740 MPa D790
ELECTRICAL
Surface Resistivity 1.0E+9- 9.9E+10 ohm/sq D257(23°C, 50%R.H)
GENERAL PROCESSING FOR INJECTION MOLDING
Injection Pressure 65 – 100 MPa
Melt Temperature 220- 250 °C
Mold Temperature 90 °C

 

PC/ABS ESD Compound Applications

esd abs,esd pc1

PC/ABS ESD compound is used as anti-static swing boxes, IC and LCD trays, IC packaging, chip carriers, film bags, etc. For the production and electric field of integrated circuits, chips, sensor sheaths and other precision electronic components in electronic products.
Shells and structural components of electrically conductive plastics for explosion-proof products, such as coal mines, oil tankers, oil fields, dust and combustible gases.
Semi-conductive shielding material used in medium and high voltage cables.
EMI shields for electrical products in telecommunications, computers, automation systems, industrial resistive products, consumer electronics, automotive electronics.

FEATURED PRODUCTS

permanent antistatic agent
permanent anti static additive
CONDUCTIVE COMPOUND
Carbon Fiber Reinforced Polycarbonate
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