ESD PC/ABS Compound
- ● The ESD compound is a formulation of PC/ABS resin and a certain amount of permanent antistatic agent,glass fiber and flame retardent are optional.
- ● Surface resitivity 10^8-10^11 Ohms/sq,colourable
- ● Features and application
- – High flow ,heat resistance
- – Electronic components;Home appliances housing
PC/ABS ESD compound properties:
- INCHR provides high performance antistatic PC/ABS alloy copolymer,especially carbon fiber grade and carbon nanotube grade .Glass fiber reinforced and flame retardent are available in this ESD compound.
- PERMANENCE
- Specific Gravity 1.20 D792
- Molding Shrinkage 0.40 - 0.60 % D955
- MECHANICAL
- Impact Strength, Izod notched 75 J/m D256
- Tensile Strength 70 MPa D638
- Tensile Elongation 8 % D638
- Tensile Modulus 2700 MPa D638
- Flexural Strength 90 MPa D790
- Flexural Modulus 2740 MPa D790
- ELECTRICAL
- Surface Resistivity 1.0E+9- 9.9E+10 ohm/sq D257(23°C, 50%R.H)
- GENERAL PROCESSING FOR INJECTION MOLDING
- Injection Pressure 65 - 100 MPa
- Melt Temperature 220- 250 °C
- Mold Temperature 90 °C
PC/ABS ESD compound applications:
- PC/ABS ESD compound is used as anti-static swing boxes, IC and LCD trays, IC packaging, chip carriers, film bags, etc. For the production and electric field of integrated circuits, chips, sensor sheaths and other precision electronic components in electronic products.
- Shells and structural components of electrically conductive plastics for explosion-proof products, such as coal mines, oil tankers, oil fields, dust and combustible gases.
- Semi-conductive shielding material used in medium and high voltage cables.
- EMI shields for electrical products in telecommunications, computers, automation systems, industrial resistive products, consumer electronics, automotive electronics.
